10 Txheej ENIG FR4 Dig muag Vias PCB
Hais txog qhov muag tsis pom faus ntawm PCB
Dig Muag Ntawm:uas ua rau muaj kev sib txuas thiab kev sib txuas ntawm cov txheej sab hauv thiab sab nrauv
Buried Ntawm:uas tuaj yeem txuas thiab qhia ntawm cov khaubncaws sab nraud povtseg Qhov muag tsis pom Vias feem ntau yog qhov me me nrog txoj kab uas hla ntawm 0.05mm ~ 0.15mm.Muaj laser qhov tsim, plasma etched qhov thiab photoinduced qhov sib sau, thiab laser qhov sib sau feem ntau yog siv.
HDI:High-density interconnection, non-mechanical drilling, micro-dig muag qhov nplhaib hauv qab 6mil, sab hauv thiab sab nrauv txheej ntawm cov kab dav / kab sib txawv yog qis dua 4mil, txoj kab uas hla ntawm lub ncoo tsis ntau dua 0.35mm yog hu ua HDI board ntau lawm hom .
Blind Vias
Qhov muag tsis pom Vias yog siv los txuas ib txheej txheej rau tsawg kawg ib txheej sab hauv.Txhua txheej ntawm qhov muag tsis pom qhov yuav tsum tau ua kom muaj cov ntaub ntawv sib cais.Qhov sib piv ntawm qhov tob rau qhov aperture (kev sib piv / thickness-inch ratio) yuav tsum tsawg dua los yog sib npaug rau 1. Lub keyhole txiav txim siab lub qhov tob, uas yog, qhov siab tshaj plaws nyob deb ntawm cov txheej txheej sab nraud thiab txheej sab hauv.