Cov khoom siv sib txuas lus PCB
Txhawm rau kom luv luv lub teeb liab kis tau tus mob thiab txo cov teeb liab kis tau tus mob, lub rooj sib tham 5G.
Kauj ruam los ntawm kauj ruam mus rau high-density thaiv, nplua hlau sib nrug, tnws txoj kev loj hlob kev taw qhia ntawm micro-aperture, nyias hom thiab kev ntseeg siab.
Nyob rau hauv-tob optimization ntawm kev siv technology thiab manufacturing txheej txheem ntawm dab dej thiab circuits, surpassing technical barriers.Ua ib lub chaw tsim khoom zoo heev ntawm 5G high-end kev sib txuas lus PCB pawg thawj coj saib.
Kev lag luam kev sib txuas lus thiab PCB khoom
| Kev lag luam kev sib txuas lus | Cov cuab yeej tseem ceeb | Yuav tsum tau cov khoom PCB | PCB feature |
| Wireless network | Kev sib txuas lus hauv paus chaw nres tsheb | Backplane, high-speed multilayer board, high-frequency microwave board, multi-function hlau substrate | Hlau puag, loj loj, siab multilayer, high zaus cov ntaub ntawv thiab sib xyaw voltage |
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Kev sib kis network | OTN kis tau tus mob cov cuab yeej, microwave kis tau tus mob cov khoom backplane, high-speed multilayer board, high-frequency microwave board | Backplane, high-speed multilayer board, high-frequency microwave board | Cov khoom siv ceev ceev, loj loj, siab multilayer, siab ceev, rov qab laum, nruj-flex sib koom, cov khoom siv ntau zaus thiab sib xyaw ua ke |
| Cov ntaub ntawv sib txuas lus | Routers, keyboards, kev pabcuam / cia Devic | Backplane, high-speed multilayer board | Cov khoom siv ceev ceev, loj loj, siab ntau txheej, siab ceev, rov qab laum, nruj-flex ua ke |
| Tsau network broadband | OLT, ONU thiab lwm yam khoom siv fiber ntau rau hauv tsev | Cov khoom siv ceev ceev, loj loj, siab ntau txheej, siab ceev, rov qab laum, nruj-flex ua ke | Multilay |
PCB Ntawm Cov Khoom Siv Sib Txuas Lus Thiab Mobile Terminal
Cov khoom siv sib txuas lus
Mobile Terminal
Cov txheej txheem nyuaj ntawm High zaus thiab siab ceev PCB Board
| Lub ntsiab lus nyuaj | Kev sib tw |
| Alignment raug | Lub precision yog nruj dua, thiab interlayer alignment yuav tsum kam rau ua convergence.Hom kev sib koom ua ke no nruj dua thaum qhov loj ntawm cov phaj hloov |
| STUB (Impedance discontinuity) | Lub STUB yog nruj dua, lub thickness ntawm lub phaj yog qhov nyuaj heev, thiab rov qab drilling tshuab yog xav tau |
| Impedance precision | Muaj ib qho kev sib tw zoo rau etching: 1. Etching yam: qhov me dua qhov zoo dua, etching raug kam rau ua yog tswj los ntawm +/-1MIL rau lineweights ntawm 10mil thiab hauv qab, thiab +/-10% rau linewidth tolerances saum 10mil.2. Cov kev xav tau ntawm kab dav, kab nrug thiab kab thickness yog siab dua.3. Lwm tus: thaiv qhov ceev, teeb liab interlayer cuam tshuam |
| Kev thov ntau ntxiv rau cov teeb liab poob | Muaj kev sib tw zoo rau kev kho saum npoo ntawm tag nrho cov tooj liab clad laminates;siab kam rau ua rau PCB thickness, nrog rau ntev, dav, thickness, verticality, hneev thiab distortion, thiab lwm yam. |
| Qhov luaj li cas yuav loj dua | Lub machinability yuav phem dua, lub maneuverability yuav zuj zus, thiab qhov dig muag qhov yuav tsum tau faus.Tus nqi nce2. Qhov tseeb ntawm kev sib dhos yog qhov nyuaj dua |
| Tus naj npawb ntawm cov txheej yuav ntau dua | Cov yam ntxwv ntawm cov kab denser thiab ntawm, chav tsev loj dua thiab nyias txheej dielectric, thiab cov kev xav tau nruj dua rau qhov chaw sab hauv, interlayer alignment, impedance tswj thiab kev ntseeg tau. |
Cov kev paub dhau los hauv kev tsim khoom sib txuas lus ntawm HUIHE Circuits
Cov kev xav tau rau qhov siab ceev:
Cov nyhuv ntawm crosstalk (lub suab nrov) yuav txo qis nrog qhov txo qis ntawm linewidth / spacing.
Cov kev cai nruj impedance:
Cov yam ntxwv impedance txuam yog qhov tseem ceeb tshaj plaws uas yuav tsum tau muaj ntawm lub siab zaus microwave board.Qhov ntau dua qhov impedance, uas yog, ntau dua qhov muaj peev xwm los tiv thaiv lub teeb liab los ntawm infiltrating mus rau hauv dielectric txheej, lub teeb liab kis tau sai dua thiab qhov tsawg dua qhov poob.
Lub precision ntawm kis kab ntau lawm yuav tsum tau siab:
Kev sib kis ntawm cov teeb liab ntau zaus yog nruj heev rau cov yam ntxwv impedance ntawm cov xov hlau luam tawm, uas yog, kev tsim khoom raug ntawm cov kab sib kis feem ntau xav kom cov kab sib txuas yuav tsum zoo nkauj heev, tsis muaj burr, notch, lossis hlau. filling.
Machining xav tau:
Ua ntej ntawm tag nrho cov, cov khoom ntawm high-frequency microwave board yog heev txawv los ntawm epoxy iav ntaub ntaub ntawm lub board luam ntawv;Qhov thib ob, qhov kev ua haujlwm siab ntawm lub rooj tsavxwm microwave siab ntau dua li ntawm cov ntawv luam tawm, thiab cov duab dav dav yog ± 0.1mm (nyob rau hauv cov ntaub ntawv ntawm qhov siab, qhov siab siab yog ± 0.05mm).
Mixed siab:
Kev sib xyaw ua ke ntawm high-frequency substrate (PTFE class) thiab high-ceev substrate (PPE class) ua rau lub high-frequency high-speed circuit board tsis tsuas yog muaj qhov loj conduction cheeb tsam, tab sis kuj muaj qhov ruaj khov dielectric tsis tu ncua, siab dielectric shielding yuav tsum. thiab kub tsis kam.Nyob rau tib lub sijhawm, qhov tshwm sim tsis zoo ntawm delamination thiab sib xyaw ua ke ntawm kev sib xyaw ua ke los ntawm qhov sib txawv ntawm adhesion thiab thermal expansion coefficient ntawm ob daim hlau sib txawv yuav tsum tau daws.
High uniformity ntawm txheej yog yuav tsum tau:
Cov yam ntxwv impedance ntawm kev sib kis kab ntawm lub siab zaus microwave board ncaj qha cuam tshuam rau kev sib kis tau zoo ntawm lub teeb liab microwave.Muaj qee qhov kev sib raug zoo ntawm cov yam ntxwv impedance thiab thickness ntawm cov ntawv ci tooj liab, tshwj xeeb tshaj yog rau lub microwave phaj nrog metallized qhov, txheej thickness tsis tsuas yog cuam tshuam rau tag nrho cov thickness ntawm cov ntawv ci tooj liab, tab sis kuj cuam tshuam qhov tseeb ntawm cov hlau tom qab etching. .Yog li ntawd, qhov loj thiab uniformity ntawm txheej thickness yuav tsum nruj me ntsis tswj.
Laser micro-los ntawm qhov ua:
Qhov tseem ceeb ntawm lub rooj tsavxwm siab ceev rau kev sib txuas lus yog lub micro-los ntawm qhov nrog qhov muag tsis pom / faus qhov qauv (aperture ≤ 0.15mm).Tam sim no, laser ua yog txoj hauv kev tseem ceeb rau kev tsim cov micro-los ntawm qhov.Qhov piv ntawm txoj kab uas hla ntawm lub qhov mus rau txoj kab uas hla ntawm lub phaj txuas yuav txawv ntawm tus neeg muag khoom mus rau tus neeg muag khoom.Qhov sib piv ntawm txoj kab uas hla ntawm lub qhov mus rau lub phaj txuas yog cuam tshuam nrog qhov tseeb ntawm qhov chaw ntawm qhov borehole, thiab cov txheej txheem ntau dua, qhov ntau dua qhov sib txawv yuav yog.tam sim no, nws yog feem ntau saws los taug qab lub hom phiaj qhov chaw txheej txheej.Rau high-density thaiv, muaj kev sib txuas tsis muaj disc los ntawm qhov.
Kev kho deg yog qhov nyuaj dua:
Nrog rau qhov nce ntau zaus, kev xaiv ntawm kev kho deg yuav ua tau ntau dua thiab tseem ceeb dua, thiab cov txheej txheem nrog cov hluav taws xob zoo thiab cov txheej nyias nyias muaj qhov cuam tshuam tsawg tshaj plaws ntawm cov teeb liab.Lub "roughness" ntawm cov hlau yuav tsum sib npaug ntawm qhov sib kis thickness uas lub teeb liab kis tau tus mob tuaj yeem lees txais, txwv tsis pub nws yog ib qho yooj yim los tsim cov teeb liab loj "sawv yoj" thiab "reflection" thiab lwm yam.Lub molecular inertia ntawm cov substrates tshwj xeeb xws li PTFE ua rau nws nyuaj rau kev sib xyaw nrog cov ntawv ci, yog li kev kho tshwj xeeb saum npoo yuav tsum tau ua kom lub ntsej muag roughness los yog ntxiv cov nplaum nplaum ntawm cov ntawv ci tooj liab thiab PTFE los txhim kho qhov adhesion.
